Evaluation of Dual-Cure Adhesives for Active
Alignment in Biomedical Imaging Devices

The assembly of biomedical imaging devices must be extremely precise to achieve optimal diagnostic capabilities. This project focuses on the characterization of dual-cure adhesives for active alignment in biomedical imaging systems, such as endoscopic cameras and ophthalmic imaging devices. Dual-cure adhesives use a two-step UV and thermal curing process to provide superior bond strength, reduced shrinkage, and long-term stability compared to single-cure alternatives—making them ideal for maintaining optical precision in biomedical applications. We evaluate the mechanical, chemical, and thermal properties of multiple dual-cure adhesive formulations to assess their suitability for biomedical device assembly. Testing includes shear strength analysis, thermal cycling, and humidity resistance trials under industry-relevant conditions. We also refine active alignment techniques to ensure precise component placement for enhanced imaging accuracy. To support streamlined manufacturing, we are developing an interactive database that recommends adhesives based on selected input parameters and performance criteria. By characterizing bond reliability, this work contributes to the advancement of biomedical diagnostic imaging; these findings have significant implications for the design and scalability of medical imaging devices, leading to better patient outcomes through improved diagnostic precision.